Heterogeneous Integration EDA Tool "START"
Equipped with a dedicated programming language that enables the development of customized tools that integrate unique technologies!
The importance of packaging, which is the latter stage of semiconductor manufacturing, is gaining attention. The advanced implementation technology can handle LSI, PKG, and optoelectronics—Co-Packaged Optics—on a single sheet, and the original 'START' from First Co., Ltd. enables seamless open database modeling for "design/edit/reuse design." This marks the dawn of the heterogeneous integration era. Chiplet SOC, multi-chip modules, 3D IC, and optoelectronic fusion CPO design/edit/reuse design/modeling can all be managed on a single database, allowing for unlimited handling of all components to accommodate heterogeneous modules that require many layers. It is equipped with a dedicated programming language that enables the development of customized tools that consolidate unique technologies, achieving unified operations from development design to manufacturing design, coupled analysis modeling, and direct control of manufacturing equipment integration. *For product details, please check the "PDF Download" below.*
- Company：ファースト
- Price：Other
